COPPER ALLOY TARGET

摘要

Provided is a copper alloy target for forming a film of an electrode to be soldered, said copper alloy target enabling low-cost formation of a copper alloy film that is not discolored after sputtering different from pure copper films, shows good solder joint properties even after treating with an inert flux, and has an excellent solder wettability. The copper alloy target according to the present invention for forming a film of an electrode to be soldered comprises copper as a main component together with 10-25 mass% exclusive of silver and 0.1-3 mass% inclusive of nickel. The copper alloy target is produced preferably by evacuating a sealable chamber to 0.01 Pa or below, then introducing an inert gas to adjust the pressure in the chamber to 50-90000 Pa inclusive, and then melting and casting metal materials therein.