| 摘要 |
PROBLEM TO BE SOLVED: To provide a support member for temperature measurement which measures the temperature of a processed object accurately without compromising the uniformity, even when heating the processed object from the lower surface side, in heating treatment using a light source as a heat source, and to provide a heat treatment apparatus.SOLUTION: A support pin 61 for measurement, used when heat-treating a wafer W by irradiating with light from a light-emitting element, has a heat conduction member 63 coming into contact with the support surface of the wafer W, and transparent for the heating light, and a temperature sensor 64 having a detector 64a located in the heat conduction member 63 in contact with the heat conduction member 63. The heat conduction member 63 is supported by a support 62 transparent for the heating light. The wafer W is irradiated with the heating light from the lower surface side of a transparent support plate 50.SELECTED DRAWING: Figure 4 |
