发明名称 FABRICATION METHOD OF FIELD EFFECT TRANSISTOR
摘要 PROBLEM TO BE SOLVED: To provide a fabrication method of a field effect transistor, facilitating the wiring formation and the formation of a semiconductor layer by inkjet printing.SOLUTION: A fabrication method of a bottom-contact type field effect transistor includes the steps of: forming a lyophilic/lyophobic pattern having a lyophilic portion and a lyophobic portion on a gate insulation film or a base material; printing a conductive ink to the lyophilic portion by inkjet printing to form a source/drain electrode; and forming a semiconductor layer by inkjet printing on the source/drain electrode. In the source/drain electrode, the width of a channel portion is 20 μm or less, the channel portion has a comb shape, and the width of the source/drain electrode is 20-50 μm.SELECTED DRAWING: Figure 1
申请公布号 JP2016076547(A) 申请公布日期 2016.05.12
申请号 JP20140204765 申请日期 2014.10.03
申请人 HITACHI CHEMICAL CO LTD 发明人 NODO TAKAAKI
分类号 H01L21/336;H01L21/288;H01L29/417;H01L29/786;H01L51/05;H01L51/30 主分类号 H01L21/336
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