| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield film for preventing problems due to bonding with an excessively large adhesive force or an excessively small adhesive force, by controlling the adhesive force for the protective layer of a separate film, and to provide a shield printed wiring board, and a method of manufacturing a shield printed wiring board.SOLUTION: On the side of a separate film 6a where irregularities 61 are formed entirely, a protective layer 7 is formed by applying resin via a releasing layer 6b and a shield film 1, on which an electromagnetic wave shield lyer 8 is formed, is placed on a printed wiring board while heating. Peel strength of the separate film for the protective layer before compressing the shield film to the printed wiring board side while heating is set larger than the peel strength of the separate film for the protective layer after compressing the shield film to the printed wiring board side while heating.SELECTED DRAWING: Figure 3 |
