| 摘要 |
PROBLEM TO BE SOLVED: To provide a headphone capable of improving a sound insulation property in simple configuration.SOLUTION: A rear-side interval L1 between a pair of ear cups 2A and 2B is made narrower than a front-side interval L2. Therefore, a headphone 1 can be mounted in such a manner that a sound emission surface S1 is matched to a shape of the head of a wearer in simple configuration. An individual difference is relatively small in a shape of a temporal region around ears, the ear cups 2A and 2B are tilted to be adaptable to the individual difference, such that the sound insulation property can be improved by improving adhesion.SELECTED DRAWING: Figure 4 |
