发明名称 SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
摘要 A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.
申请公布号 US2016135293(A1) 申请公布日期 2016.05.12
申请号 US201414534482 申请日期 2014.11.06
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 Lin Yusheng;Takakusaki Sadamichi
分类号 H05K1/03;H01L21/48;H05K3/00;H05K3/46;H05K3/06;H01L23/14;H05K1/09 主分类号 H05K1/03
代理机构 代理人
主权项
地址 Phoenix AZ US