Circuit Carrier, Method for Producing a Circuit Carrier, Method for Producing a Circuit Arrangement, Method for Operating a Circuit Arrangement and Method for Producing a Semiconductor Module

摘要

A circuit carrier includes a dielectric isolation carrier, an upper metallization layer applied to the dielectric isolation carrier, and a dielectric coating. The upper metallization layer has a metallization section which has an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion. The side surface laterally delimits the metallization section and extends continuously between the top side and the underside. The dielectric coating is on the side surface and the top side, and extends continuously from the side surface onto the top side.

主权项

1. A circuit carrier, comprising:
a dielectric isolation carrier; an upper metallization layer applied to the dielectric isolation carrier and having a metallization section, the metallization section having an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion, the side surface laterally delimiting the metallization section and extending continuously between the top side and the underside; a dielectric coating which bears on the side surface and the top side, and extends continuously from the side surface onto the top side.