| 摘要 |
An apparatus for transporting a circuit board in a reflow soldering process according to the present invention comprises a pair of base frames which are extended long along one direction and respectively separated in a width direction; a pair of transporting chains which are arranged in parallel to the length direction of the base frame, are respectively mounted on the base frame, and mounts both side of a circuit board in the width direction; a pair of mounting blocks which are combined at a point separated with a preset distance from a point where the transporting chain is mounted on an upper surface of the base frame; a rotating bar which is combined with a side toward the transporting chain among the sides of the mounting block to be rotatable around a hinge pin in a horizontal direction, and possesses a horizontal shaft protruding in parallel to the hinge pin; a sprocket which is mounted on the horizontal shaft to be rotatable and possesses a plurality of teeth engaged in the transporting chain; an idler gear which is combined to be laid on one surface of the sprocket, and pressurizes an upper surface of the circuit board mounted on the transporting chain downwards; and an elastic piece (700) whose one end is combined with the mounting block (300) and the other end pressurizes the rotating bar (400) downwards. |
