| 摘要 |
The present invention relates to a movable chemical mechanical polishing (CMP) system comprising: a substrate carrier unit moving along a moving path passing through one or more polishing plates, on which a CMP process is performed, while carrying a substrate and having a positioning hole formed on the outer surface thereof; and a docking unit having an alignment protrusion inserted in the positioning hole of the substrate carrier unit, docked with the substrate carrier unit while being aligned with the substrate carrier unit by the insertion of the alignment protrusion in the positioning hole, and supplying at least one among power, air pressure, and rotational driving force. The CMP system according to the present invention can minimize impacts generated during docking by elastically supporting the alignment protrusion to be moved in a first direction perpendicular to a docking direction, thereby preventing misalignment due to the impacts. Also, the CMP system can accurately maintain a docking position of the docking unit and the substrate carrier unit even in a long-term usage by preventing damage to the alignment protrusion or the positioning hole, thereby always smoothly supplying power. |
