| 摘要 |
PROBLEM TO BE SOLVED: To provide an Au type solder alloy which has uniform wet spreading property and high bonding reliability and, further, can retain solder volume substantially contributing to bonding and encapsulation.SOLUTION: An Au-Ge type solder alloy comprises 10.0 to 15.0 mass%, preferably 11.5 to 13.5 mass% of Ge and the balance Au with elements inevitably contained upon manufacture. Therein, such a lamella structure that a stripe interval of striped structure is 0.01 to 0.75 μm and/or a metallographic structure made of circular and ellipsoidal structures which respectively have a diameter in the case of a circular shape and a minor axis in the case of an elliptic shape, of 0.01 to 0.75 μm occupies an area of 25% or less with respect to the total cross-section.SELECTED DRAWING: Figure 2 |
