发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 (OBJECT) The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials.;(MEANS FOR SOLVING THE PROBLEM) In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.
申请公布号 US2016133683(A1) 申请公布日期 2016.05.12
申请号 US201615000710 申请日期 2016.01.19
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Takayama Toru;MARUYAMA Junya;OHNO Yumiko;MURAKAMI Masakazu;HAMATANI Toshiji;KUWABARA Hideaki;YAMAZAKI Shunpei
分类号 H01L27/32;H01L27/12;H01L51/52 主分类号 H01L27/32
代理机构 代理人
主权项 1. (canceled)
地址 Atsugi-shi JP