| 发明名称 |
LED MODULE WITH LED CHIPS |
| 摘要 |
Various embodiments may relate to an LED module, including a number of first inherently unpackaged LED chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged LED chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The LED chips are provided jointly in a housing, and the respective light emission area of a second LED chip is at least 25% smaller than the respective light emission area of a first LED chip. The sum of the light emission areas of the first LED chips is at least 50% greater than the sum of the light emission areas of the second LED chips. |
| 申请公布号 |
US2016133612(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201414899163 |
申请日期 |
2014.06.12 |
| 申请人 |
OSRAM GMBH |
发明人 |
Windisch Reiner;Bergenek Krister;Biebersdorf Andreas;Wirth Ralph |
| 分类号 |
H01L25/075;H01L33/50 |
主分类号 |
H01L25/075 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An LED module comprising
a number of first inherently unpackaged LED chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged LED chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area, wherein the LED chips are provided jointly in a housing, and the respective light emission area of a second LED chip is at least 25% smaller than the respective light emission area of a first LED chip, wherein the sum of the light emission areas of the first LED chips is at least 50% greater than the sum of the light emission areas of the second LED chips. |
| 地址 |
München DE |
