发明名称 |
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF |
摘要 |
A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically connected to the first circuit layer and having one ends exposed from the second surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and electrically connected the ends of the conductive posts exposed from the second surface of the dielectric layer; and a plurality of protruding elements formed on the surface of the first circuit layer exposed from the first surface of the dielectric layer, thereby providing a large contact area so as to strengthen bonding between a semiconductor chip and the first circuit layer of the package structure. |
申请公布号 |
US2016133551(A1) |
申请公布日期 |
2016.05.12 |
申请号 |
US201514695125 |
申请日期 |
2015.04.24 |
申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Hsiao Wei-Chung |
分类号 |
H01L23/498;H01L21/48;H01L21/56;H01L23/31;H01L23/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
1. A package structure, comprising:
a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically connected to the first circuit layer and having one ends exposed from the second surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and electrically connected to the ends of the conductive posts exposed from the second surface of the dielectric layer; and a plurality of protruding elements formed on the surface of the first circuit layer exposed from the first surface of the dielectric layer. |
地址 |
Taichung TW |