DOUBLE LAYER RELEASE TEMPORARY BOND AND DEBOND PROCESSES AND SYSTEMS
摘要
A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.
申请公布号
WO2016071793(A1)
申请公布日期
2016.05.12
申请号
WO2015IB58157
申请日期
2015.10.22
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;IBM (CHINA) INVESTMENT COMPANY LIMITED
发明人
KNICKERBOCKER, JOHN;DANG, BING;ANDRY, PAUL;TSANG, CORNELIA, KANG-L;HUNG, LI-WEN;BUDD, RUSSELL