| 摘要 |
Provided is an ultrathin flake-like silver powder which enables an electroconductive material to be applied thinly and uniformly when this powder is used as an electroconductive filler, and for which there is little change in resistance even when a flexible circuit, electroconductive rubber, or the like is deformed. In this silver powder the 50% particle diameter as measured by laser diffraction is 3-8 mum and the average thickness is 20-40 nm. The aforementioned ultrathin flake-like silver powder is provided by means of a manufacturing method having: a step wherein a flake-like silver powder material having a thickness of 60-130 nm is prepared; and a step wherein this flake-like silver powder material is expanded, resulting in an average thickness of 20-40 nm, by using a medium-stirring type wet-grinding device that uses a medium having a diameter of 0.015-0.2 mm. |
