发明名称 |
HIGH TEMPERATURE DEBONDABLE ADHESIVE |
摘要 |
A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetra-siloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300° C. or greater, and is mechanically debondable at room temperature at a force less than 5N/25 mm. |
申请公布号 |
EP3017012(A1) |
申请公布日期 |
2016.05.11 |
申请号 |
EP20130888708 |
申请日期 |
2013.07.03 |
申请人 |
HENKEL IP & HOLDING GMBH;HENKEL (CHINA) INVESTMENT CO. LTD.;HENKEL AG & CO. KGAA |
发明人 |
ZHANG, WENHUA;HUANG, XIAOYAN;KONG, SHENGQIAN;YUE, XIAO ALISON;SUN, CHUNYU;OUYANG, JIANGBO;HYNES, STEPHEN |
分类号 |
C09J183/05;B32B7/12;C09J5/06;C09J183/07 |
主分类号 |
C09J183/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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