| 摘要 |
A semiconductor package comprises an upper package, and a lower package having a plurality of fan-out mutual connection structures. A plurality of connectors between packages are placed in a gap between the upper package and the lower package. A conductive protection layer is formed on the semiconductor package, and seals a gap around the edge of the semiconductor package. Also, the conductive protection layer covers the upper surface and a side wall of the upper package, and also covers part of the upper surface of the lower package extended as passing the boundary between the upper part of a side wall of the lower package and the upper package. Therefore, proper protection against electrostatic discharge can prevent circuits inside the packages from easily being damaged. |
