| 摘要 |
A fiber bundle processing device (filament winding device (100)) that processes a fiber bundle (Fb) having a heat-curable resin impregnated therein, characterized by: comprising a curing device (45A) capable of applying heat to the fiber bundle (Fb); and the curing device (45A) curing or semi-curing some of the resin impregnated into the fiber bundle (Fb), when the fiber bundle (Fb) is partway through being guided into the fiber bundle processing device (filament winding device (100)). |
