LAMINATION APPARATUS

摘要

According to the present invention, a bonding system is disclosed. According to the present invention, the bonding system comprises: a first bonding chamber configured to bond a first member and a second member; a second bonding chamber arranged to be separated from the first bonding chamber and configured to bond the first member and the second member; and a transfer unit arranged on a side of the first bonding chamber and the second bonding chamber and configured to transfer and arrange the first member and the second member to and in at least one of the first bonding chamber and the second bonding chamber.