BONDING APPRATUS OF MULTI ARRAYED SUBSTRATES

摘要

The present invention relates to an apparatus for bonding a cell substrate for a cover glass of a touch panel to one carrier in a state that the cell substrate is arrayed. The apparatus for bonding a multi-array substrate comprises: a carrier supply unit for sequentially supplying one or more carriers; a resin coating unit for coating a predetermined area of the carrier which is carried from the carrier supply unit with a bonding resin; a cell substrate supply unit for carrying a plurality of cell substrates to the bonding resin-coated area of the carrier carried from the resin coating unit; an array unit for arraying the cell substrates carried to the carrier on the carrier according to a predetermined array reference; and a bonding unit for bonding the arrayed cell substrates with the carrier. In spite of process error, each of a plurality of cell substrates can be bonded to a predetermined specific position on the carrier, which is the center of each of a plurality of figure marks arranged at regular intervals, while the cell substrates are accurately arrayed on the specific position. Thus, it is possible to manufacture an integrated multi-array substrate having the cell substrates bonded on one carrier in a state of being arrayed thereon.