发明名称 ボンディング方法及びボンディング装置
摘要 [Problem] To provide a wire bonding method and wire bonding device whereby a free air ball with a large ball diameter can be formed stably while suppressing the oxidation of the free air ball. [Solution] In addition to the supply of anti-oxidation gas from a gas supply means (10) into an insertion portion (32), anti-oxidation gas is supplied via a gas supply nozzle (40) disposed outside the insertion portion (32) so as to cover an entry of the insertion portion (32), and a spark discharge is caused with the tip of a wire (74) positioned inside the insertion portion (32) and with the tip of a capillary (3) positioned outside the insertion portion (32), whereby a free air ball (75) having a large ball diameter can be formed stably while oxidation of the free air ball (75) is suppressed.
申请公布号 JP5916814(B2) 申请公布日期 2016.05.11
申请号 JP20140160889 申请日期 2014.08.06
申请人 株式会社カイジョー 发明人 吉田 光;白戸 瑞穂
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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