AN INTERCONNECT SYSTEM COMPRISING AN INTERCONNECT HAVING A PLURALITY OF METAL CORES AT LEAST PARTIALLY SURROUNDED BY A DIELECTRIC LAYER

摘要

A die interconnect system having a first die with a plurality of connection pads, and a ribbon lead extending from the first die, the ribbon lead having a plurality of metal cores with a core diameter, and a dielectric layer surrounding the metal core with a dielectric thickness, with at least a portion of dielectric being fused between adjacent metal cores along the length of the plurality of metal cores, and an outer metal layer attached to ground.