| 摘要 |
When a film containing constituent elements of a target (T) is formed on a substrate (B) through a vapor deposition process using plasma with placing the substrate (B) and the target (T) to face to each other, the film is formed with surrounding the substrate (B) with a wall surface (10S, 41S) having the constituent elements of the target (T) adhering thereto, and applying a physical treatment to the wall surface (10S, 41S) to cause the components adhering to the wall surface (10S, 41S) to be released into the film formation atmosphere. |
