| 摘要 |
A mounting apparatus includes a first mounting head, a second mounting head, and a controller. The first mounting head and the second mounting head are configured to each repeat a holding operation of holding an electronic component and a mounting operation of mounting the electronic component held on a substrate to alternately mount the electronic components on the substrate. The controller is configured to compare, when the first mounting head and the second mounting head complete the holding operation and are each in a state of being capable of mounting the electronic component, a first value relating to a remaining mounting time period of the first mounting head and a second value relating to a remaining mounting time period of the second mounting head, to cause the mounting operation by the mounting head corresponding to a larger value between the first value and the second value to be preferentially performed. |
