| 摘要 |
The present invention relates to an LED headlamp for a vehicle having an excellent heat dissipation property, and more specifically, to an LED headlamp for a vehicle having an excellent heat dissipation property which can improve a heat dissipation property by an organic mounting relationship of a module mounting plate, a heat pipe, and a heat dissipation plate for heat dissipation to prevent damage to an LED headlamp by an increase in temperature caused by heat generated by turning on the LED headlamp for a long period of time. According to the present invention, the LED headlamp for a vehicle having an excellent heat dissipation property is installed on a vehicle to emit light forwards, and comprises: a mounting base detachably mounted on a headlamp mounting portion of the vehicle; a body which is formed in a polygonal column shape, protrudes to the front of the mounting base, has a through hole formed in the middle therein in a longitudinal direction, and comprises a plurality of module mounting plates disposed on an outer surface thereof and made of a thermally conductive material; an LED module provided with one or more LED chips arranged on a front surface of a PCB, and mounted on the module mounting plates of the body; a heat pipe made of a thermally conductive material, wherein one end thereof is inserted into the through hole of the body, and the other end thereof protrudes to the rear of the mounting base; and a heat dissipation plate made of a thermally conductive material and mounted from the rear of the mounting base to enclose the other end of the heat pipe. |
