| 摘要 |
The present invention relates to an LED package stacked in four stages and a manufacturing method thereof. The LED package comprises: a heat sink which has a groove formed on the upper face thereof; a nonconductor circuit board protective plate which is formed in the groove of the heat sink; a conductor circuit board which is formed on one side of the nonconductor circuit bard protective plate; an insulation layer which is formed on one side of the nonconductor circuit board; and an LED chip which is formed on the upside of the insulation layer. According to the present invention, the insulation layer is formed directly on the heat sink and a pattern is formed. Accordingly, unnecessary thermal grease, conductor circuit board heat radiation materials (AL/CU), SMT operation, and silicon carbide ceramic housing are removed, thereby raising thermal conductivity and minimizing the heat congestion phenomenon. |
