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发明名称
双面铜箔基板结构
摘要
双面铜箔基板结构,系包括:具有相对之第一表面与第二表面之黏着层;以及二铜层合板,各该铜层合板系包括铜箔及绝缘聚合物层,并分别以该绝缘聚合物层结合至该黏着层之第一表面与第二表面,藉以使该双面铜箔基板结构不仅具有轻、薄、高挠曲性能、低反弹力等优点,更可实现产品高密度化及精细间距的要求。
申请公布号
TWM521863
申请公布日期
2016.05.11
申请号
TW105201213
申请日期
2016.01.27
申请人
亚洲电材股份有限公司
发明人
张孟浩;李建辉
分类号
H05K1/03(2006.01)
主分类号
H05K1/03(2006.01)
代理机构
代理人
陈昭诚
主权项
一种双面铜箔基板结构,系包括:黏着层,系具有相对之第一表面与第二表面;以及二铜层合板,各该铜层合板系包括铜箔及绝缘聚合物层,并分别以该绝缘聚合物层结合至该黏着层之第一表面与第二表面。
地址
新竹县竹北市中华路676巷18号4楼
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