| 摘要 |
Disclosed is a resin composition comprising: an epoxy compound composition comprising at least two epoxy compounds each of which has a phosphazene ring and an epoxy group, and each of which is produced by the reaction of a polyfunctional glycidyl compound (e.g., a glycidyl ether of Bisphenol A) with a hydroxy-containing cyclic phosphazene compound (e.g., a hydroxyphenoxy-phenoxy-mix-substituted cyclic phosphazene compound); and at least one resin component selected from the group consisting of a thermoplastic resin and a thermosetting resin. The resin composition is excellent in heat resistance, high-temperature reliability and flame retardancy, and enables to form a molded resin article having properties inherent to the resin component. The molded resin article can be used as a sealing agent for an electronic component (e.g., an LSI), a substrate or the like. |
