| 摘要 |
An electronic component mounting substrate (1) includes an electronic component (3) mounted on a surface of a substrate (2), an electrode portion (4) disposed on the surface of the substrate (2) and electrically connected to the electronic component (3), a lead wire (5) connected to the electrode portion (4), and an encapsulation resin (7) configured to encapsulate a part of the lead wire (5), the electronic component (3), and the electrode portion (4). A surface of at least the part of the lead wire (5) encapsulated by the encapsulation resin (7) and the surface of the substrate (2) are coated with a deposited film (6). |
