发明名称 |
HEAT ISOLATION STRUCTURES FOR HIGH BANDWIDTH INTERCONNECTS |
摘要 |
A die interconnect system having a plurality of connection pads, a heat generating element thermally isolated from the die, one or more leads extending from the die to the heat generating element, each lead having a metal core with a core diameter, a dielectric layer surrounding the metal core with a dielectric thickness, and an outer metal layer attached to ground, wherein one or more leads are exposed to ambient conditions and/or are convectively or contact cooled for at least a portion of their length to minimize heat transfer from the heat generating element to the die. |
申请公布号 |
EP3017469(A2) |
申请公布日期 |
2016.05.11 |
申请号 |
EP20140735473 |
申请日期 |
2014.07.02 |
申请人 |
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG |
发明人 |
CAHILL, SEAN, S.;SANJUAN, ERIC, A. |
分类号 |
H01L23/49;G01J5/06;G01J5/20;H01L23/367;H01L23/467;H01L23/473;H01L23/66;H01L27/146;H01S5/024 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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