| 摘要 |
A semiconductor die arrangement comprising a first die (102) including at least one semiconductor device; a second die (103) including at least one semiconductor device; a lead frame (120) associated with the first die (102) and comprising one or more lead fingers (121,122,123), wherein the second die (103) is mounted on one of the lead fingers and electrically connected to a further die by a bond wire (125). |
