发明名称 Semiconductor device and method of making semiconductor device
摘要 One or more embodiments are related to a semiconductor device, comprising: a high-K dielectric material; and a nitrogen-doped silicon material disposed over said high-k dielectric material.
申请公布号 US9337047(B2) 申请公布日期 2016.05.10
申请号 US200711856086 申请日期 2007.09.17
申请人 Infineon Technologies AG 发明人 Shum Danny Pak-Chum;Kakoschke Ronald;Power John;Langheinrich Wolfram
分类号 H01L29/788;H01L21/4763;H01L21/28;H01L27/105;H01L27/115;H01L29/66;H01L29/78 主分类号 H01L29/788
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A semiconductor memory device, comprising: a semiconductor substrate; a first dielectric layer disposed over said semiconductor substrate; a first conductive layer disposed over said first dielectric layer; a high-k dielectric layer disposed over said first conductive layer; a nitrogen-doped silicon material disposed over and in direct contact with said high-k dielectric layer, wherein the high-k dielectric layer and the nitrogen-doped silicon material comprise different compositions; and a second conductive layer disposed over and in direct contact with said nitrogen-doped silicon material, wherein the high-k dielectric layer and the nitrogen-doped silicon material are disposed between the first conductive layer and the second conductive layer.
地址 Neubiberg DE