发明名称 |
Semiconductor device and method of making semiconductor device |
摘要 |
One or more embodiments are related to a semiconductor device, comprising: a high-K dielectric material; and a nitrogen-doped silicon material disposed over said high-k dielectric material. |
申请公布号 |
US9337047(B2) |
申请公布日期 |
2016.05.10 |
申请号 |
US200711856086 |
申请日期 |
2007.09.17 |
申请人 |
Infineon Technologies AG |
发明人 |
Shum Danny Pak-Chum;Kakoschke Ronald;Power John;Langheinrich Wolfram |
分类号 |
H01L29/788;H01L21/4763;H01L21/28;H01L27/105;H01L27/115;H01L29/66;H01L29/78 |
主分类号 |
H01L29/788 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A semiconductor memory device, comprising:
a semiconductor substrate; a first dielectric layer disposed over said semiconductor substrate; a first conductive layer disposed over said first dielectric layer; a high-k dielectric layer disposed over said first conductive layer; a nitrogen-doped silicon material disposed over and in direct contact with said high-k dielectric layer, wherein the high-k dielectric layer and the nitrogen-doped silicon material comprise different compositions; and a second conductive layer disposed over and in direct contact with said nitrogen-doped silicon material, wherein the high-k dielectric layer and the nitrogen-doped silicon material are disposed between the first conductive layer and the second conductive layer. |
地址 |
Neubiberg DE |