| 发明名称 |
Underfill sealant composition |
| 摘要 |
The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group. |
| 申请公布号 |
US9334429(B2) |
申请公布日期 |
2016.05.10 |
| 申请号 |
US201414200871 |
申请日期 |
2014.03.07 |
| 申请人 |
Henkel AG & Co. KGaA |
发明人 |
Horiguchi Yusuke;Sano Mieko;Sato Kenichiro |
| 分类号 |
C09J133/14;H01L21/56;H01L23/00;H01L23/29;C09D4/06;C09D135/00 |
主分类号 |
C09J133/14 |
| 代理机构 |
|
代理人 |
Bauman Steven C. |
| 主权项 |
1. An underfill sealant composition comprising:
(a) a (meth)acrylic compound, (b) a maleimide compound, and (c) an isocyanuric acid having an allyl group, wherein the maleimide compound (b) comprises a bismaleimide; the composition further comprising a thermal radical initiator. |
| 地址 |
Duesseldorf DE |
