Antenna-printed circuit board package

摘要

An antenna-printed circuit board (PCB) package is provided. The antenna-PCB package includes a PCB; an antenna portion formed on an upper surface of the PCB and inside the PCB; and a radio frequency integrated circuit (RFIC) chip bonded to a lower surface of the PCB.

主权项

1. An antenna-printed circuit board (PCB) package comprising:
a PCB including a plurality of conductive plates and dielectric layers, the plurality of conductive plates being electrically separated by dielectric layers therebetween; an antenna portion including at least two planar pattern layers configured to irradiate a wireless signal, wherein one of the two layers is on a first surface of the PCB, the first surface being an outmost surface of the PCB, and the other of the two layers is inside the PCB, and the at least two planar pattern layers are stacked to overlap each other; a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB opposite to the first surface, the second surface being another outmost surface of the PCB; and a signal line configured to transmit a signal be irradiated by the antenna portion from the RFIC chip to the antenna portion, wherein the signal line is fed to the other of the two layers that is inside the PCB and is not fed to the one of the two layers that s on the first surface of the PCB.