Method for simultaneously cutting a multiplicity of wafers from a workpiece

摘要

A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece includes applying a cut-in beam on the workpiece where the cut-in beam has a head end and a foot end. The head end is inserted into the notch of the workpiece. The workpiece is held with a feed device so as to position an axis of the work piece parallel to the axes of cylindrical wire guide rollers of a wire saw. The cut-in beam is moved through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller. The wire sections are moved the longitudinal wire direction in the presence of abrasives.

主权项

1. A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece, the method comprising:
applying a cut-in beam on the workpiece, the cut-in beam having a front end, a rear end, a head end and a foot end, where the head end of the cut-in beam is inserted with a form fit into the notch of the workpiece and the foot end of the cut-in beam protrudes out of the notch; holding the workpiece with a feed device so as to position an axis of the work piece parallel to axes of a cylindrical wire guide rollers of a wire saw; moving the cut-in beam of the workpiece, using the feed device, in a feed direction perpendicularly through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller, the wire sections being guided multiple times in a spiral around grooves in the wire guide rollers such that the cut in beam is moved first with the foot end against the wire web and the work piece is moved first with the notch against the wire web; and moving the wire sections in the longitudinal wire direction by rotation of the wire guide rollers in the same direction and at the same circumferential speed in the presence of abrasives acting as a grinding agent.