| 摘要 |
The purpose of the present invention is to improve the measurement accuracy of a thermal flow meter. This thermal flow meter is obtained by: molding a circuit package (400) for measuring flow rates in a first resin molding step; resin molding a housing (302), which is provided with an inlet groove (351), a front auxiliary passage groove (332), an outlet groove (353), and the like, in a second resin molding step; and then enclosing the outer peripheral surface of the circuit package (400) manufactured in the first molding step with a resin in the second molding step, and fixing the circuit package to the housing (302). |
