| 发明名称 |
Implementing low temperature wafer test |
| 摘要 |
A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed. |
| 申请公布号 |
US9335367(B2) |
申请公布日期 |
2016.05.10 |
| 申请号 |
US201314010657 |
申请日期 |
2013.08.27 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Hebig Travis R.;Kuczynski Joseph;Nickel Steven R. |
| 分类号 |
G01R31/28 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
Pennington Joan |
| 主权项 |
1. A method for implementing low temperature wafer testing of a completed wafer comprising:
applying a coolant gel to the completed wafer, said coolant gel being electrically insulating and hydrophobic; cooling the gel coated wafer in a temperature range including −40° C. or −55° C.; applying one or more electrical test probes through the gel to electrical contacts of the cooled wafer, said coolant gel eliminating condensation on the electrical contacts, and performing testing of the cooled wafer. |
| 地址 |
Armonk NY US |
