PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST

摘要

The present invention relates to a photo-curable and thermosetting resin composition and a dry film solder resist produced therefrom. The photo-curable and thermosetting resin composition comprises: an acid modified oligomer including an iminocarbonate-based compound having a carboxyl group and a photo-curable unsaturated functional group; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermosetting binder having a thermo-curable functional group; a functional filler including one or more selected from the group consisting of a radiation ceramic particle and a carbon allotropic particle having a ceramic compound bonded on the surface thereof; and a photoinitiator. Without reduction in dielectric strength, excellent thermal conduction properties and electromagnetic wave absorbing functions may be ensured.