Optimization of start-up transient processes for dual-armed cluster tools with wafer revisiting

摘要

A method for scheduling dual-armed cluster tools with wafer revisiting is provided. In order to speed up start-up transient processes, the present invention adopts a program evaluation and review technique for the analysis of start-up transient processes and develops optimization algorithms for their scheduling for dual-arm cluster tools. Then, their complexity is analyzed.

主权项

1. A computer implemented method for scheduling a dual-armed cluster tool with wafer revisiting for a transient process of a wafer fabrication system, the dual-armed cluster tool comprising a robot having two arms, and three process modules PMs, each for performing a wafer-processing Step, where PMi is used for performing a processing Step i of the three wafer-processing steps for each wafer, iεN3={1, 2, 3}, the wafer revisiting comprising a wafer flow pattern as (PM1, (PM2, PM3)2) with (PM2, PM3)2 being a 2-revisiting process, the method comprising:
obtaining, by a processor, a wafer processing time ai for each of the three processing Step iεN3={1, 2, 3}, a wafer loading time β for the robot, a wafer unloading time α for the robot, a moving time μ for the robot moving from one process module to another, and a swapping time λ for a swap operation executed by the robot as follows:
holding a wafer in one arm;unloading a processed wafer from PMi by the other arm;rotating; andloading the wafer into PMi; determining, by a processor, a plurality of algorithms of the transient process based on a plurality of robot task sequences θs for the robot, a plurality of system states Mj, j being a positive integer, and a program evaluation and review technique, wherein the transient process starts from an initial state among the system states and reaches to a steady state among the system states, and the initial state represents that no wafer is processed in the three PMs and the arms of the robot are empty, and the final states represents that a 3rd, a 1st and a 2nd wafers are processed in PM1, PM2, and PM3 for their 1st, 4th, and 3rd operations respectively, wherein each of the system states represents a Node k, k being a positive integer, in the program evaluation and review technique, wherein the algorithms of the transient process execute a plurality of if-then instructions as follows: if Π1≦Πlocal+ψ1, then a cycle time of the wafer fabrication system is a constant, andΠ(8+3⁢⁢i)⁢(11+3⁢⁢i)=⁢{2⁢Πlocal,if⁢⁢Πlocal≥⁢ψ1Πlocal+ψ1,if⁢⁢ψ1>Πlocal≥φ1ψ1+φ1,if⁢⁢φ1>Πlocal; if Π1>2Πlocal and Πlocal≧ψ1, then a cycle time of the wafer fabrication system is Π1 time units; and if Π1>Πlocal+ψ1 and φ1≦Πlocal<ψ1, then a cycle time of the wafer fabrication system is Π1 time units;
where Πi=ai+λ denote a time needed for completing a wafer at the processing Step i;Πlocal=max{Π2, Π3};ψ1=3λ+4μ+α+β;Πij denotes a time taken by θij, where θij, j≧0, denotes a robot task sequence which transfers Mi to Mj; andφ1=2μ+2λ denotes a local robot cycle time; computing, by a processor, a time to reach the steady state from the initial state via performing each of the algorithms of the transient process based on the wafer processing time, the wafer loading time, the wafer unloading time, the moving time, and the swapping time; and determining, by a processor, a corresponding robot task sequences given by the one of the algorithms of the transient process having a minimal time to reach the steady state among the computed times, wherein the determined robot task sequences are used for scheduling the transient process.