| 摘要 |
The present invention relates to a power module, integrated with a power semiconductor, and a packaging method thereof. According to an embodiment of the present invention, the power module includes: a silicon-based power semiconductor chip; and an insulating substrate placed on both sides of the power semiconductor chip, and including a metal pattern directly and electrically connected to the power semiconductor chip. Therefore, the power module is capable of reducing thermal resistance, thereby improving a radiation effect. |
