发明名称 Semiconductor light-emitting device
摘要 A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.
申请公布号 US9337394(B2) 申请公布日期 2016.05.10
申请号 US201414554488 申请日期 2014.11.26
申请人 Epistar Corporation 发明人 Chen Yi-Ming;Lin Chun-Yu;Yang Tsung-Hsien;Hsu Tzu-Chieh;Lin Kun-De;Chan Yao-Ning;Lu Chih-Chiang
分类号 H01L33/38;H01L33/22;H01L33/46 主分类号 H01L33/38
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A semiconductor light-emitting device, comprising: a transparent substrate; a semiconductor stack formed on the transparent substrate, and comprising a first semiconductor layer, and a second semiconductor layer, wherein the second semiconductor layer is closer to the transparent substrate than the first semiconductor layer is to the transparent substrate; a reflective layer formed on the first semiconductor layer; a plurality of conductive vias extending from a surface of the first semiconductor layer to a surface of the second semiconductor layer; a connecting layer formed in the plurality of conductive vias and on the surface of the first semiconductor layer; a first pad portion formed on the semiconductor stack; and a second pad portion formed on the semiconductor stack, wherein a shortest distance between two of the plurality of conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.
地址 Hsinchu TW