Method for producing a semiconductor layer sequence, radiation-emitting semiconductor chip and optoelectronic component

摘要

A method can be used for producing a semiconductor layer sequence, which is based on a nitride compound semiconductor material and which comprises a microstructured outer surface. The method has the following steps: A) growing at least one first semiconductor layer of the semiconductor layer sequence on a substrate; B) applying an etch-resistant layer on the first semiconductor layer; C) growing at least one further semiconductor layer on the layer sequence obtained in step B); D) separating the semiconductor layer sequence from the substrate, a separating zone of the semiconductor layer sequence being at least partly removed; E) etching the obtained separating surface of the semiconductor layer sequence by an etching means such that a microstructuring of the first semiconductor layer is carried out and the microstructured outer surface is formed.

主权项

1. A method for producing a semiconductor layer sequence based on nitride compound semiconductor material and having a microstructured outer surface, the method comprising: growing a first semiconductor layer of the semiconductor layer sequence on a substrate; applying an etch stop layer on the first semiconductor layer in a manner that the etch stop layer completely covers the first semiconductor layer, the etch stop layer comprising silicon dioxide, silicon nitride, or magnesium nitride, and the etch stop layer having a thickness between 0.4 and 2 nm, inclusive; growing a further semiconductor layer on the semiconductor layer sequence obtained after applying the etching step layer, wherein the etch stop layer is configured to prevent etching of the further semiconductor layer; separating the semiconductor layer sequence from the substrate by at least partially removing a separating zone of the semiconductor layer sequence; and etching an obtained separating surface of the semiconductor layer sequence by use of an etchant, such that a microstructuring of the first semiconductor layer is effected and the microstructured outer surface is formed.