Multi-chip module with multiple interposers

摘要

A Multi-Chip Module is presented herein that comprises a package substrate, at least two integrated circuit devices, each of which is electrically coupled to the package substrate, and an interposer. Formed in the interposer are electrical connections which are predominantly horizontal interconnects. The first interposer is arranged to electrically couple the two integrated circuit devices to each other. Methods for manufacturing a Multi-Chip Module are also presented herein.

主权项

1. An apparatus comprising:
a package substrate; at least two integrated circuit devices, each of which is electrically coupled to the package substrate; a first interposer comprising predominantly horizontal interconnects formed therein, the first interposer being arranged between the at least two integrated circuit device to electrically couple the at least two integrated circuit devices to each other, a second interposer; and a third interposer, wherein for a first of the at least two integrated circuit devices, an area of overlap between the first of the at least two integrated circuit devices and the first interposer is less than an area of the first of the at least two integrated circuit devices, and wherein the first of the at least two integrated circuit devices overlaps with the first interposer and the second interposer and does not overlap with the third interposer, and wherein the second of the at least two integrated circuit devices overlaps with the first interposer and the third interposer and does not overlap with the second interposer.