| 发明名称 | Chip package and method thereof | ||
| 摘要 | A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench. | ||
| 申请公布号 | US9334156(B2) | 申请公布日期 | 2016.05.10 |
| 申请号 | US201514747507 | 申请日期 | 2015.06.23 |
| 申请人 | XINTEC INC. | 发明人 | Lin Chien-Min;Huang Yu-Ting;Fu Chen-Ning;Ho Yen-Shih |
| 分类号 | B81B7/00;B81C1/00;H01L21/48;H01L23/498 | 主分类号 | B81B7/00 |
| 代理机构 | Liu & Liu | 代理人 | Liu & Liu |
| 主权项 | 1. A chip package, comprising: a semiconductor chip having at least one sensing device and at least one conductive pad electrically connected to the at least one sensing device; an interposer disposed on the semiconductor chip, the interposer having at least one trench and at least one through hole, the trench penetrating the interposer, and the through hole exposing the conductive pad; a polymer adhesive supporting layer interposed between the semiconductor chip and the interposer; a redistribution layer disposed on the interposer and in the through hole to be electrically connected to the conductive pad; and a packaging layer covering the interposer and the redistribution layer, the packaging layer having an opening exposing the trench. | ||
| 地址 | Taoyuan TW | ||