发明名称 |
Compact wearable biological sensor modules |
摘要 |
A sensor module can include a battery housing comprising a battery cavity sized and shaped to receive a battery. The battery cavity can be defined at least in part by a wall to be disposed about at least a portion of a periphery of the battery. A package housing can be disposed on the wall of the battery housing, the package housing smaller than the battery housing. An integrated device package can be disposed in or coupled with the package cavity. The integrated device package can include one or more integrated device dies. An interfacing feature can be coupled with the battery housing and extending transverse to the wall. The interfacing feature can be configured to transduce a biological signature into a signal to be processed by the integrated device package. An interconnect assembly can electrically connect the interfacing feature to the integrated device package. |
申请公布号 |
US9332940(B1) |
申请公布日期 |
2016.05.10 |
申请号 |
US201514589685 |
申请日期 |
2015.01.05 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
Bolognia David Frank |
分类号 |
A61B5/00;A61B5/024;A61B5/11 |
主分类号 |
A61B5/00 |
代理机构 |
Knobbe, Martens, Olson & Bear LLP |
代理人 |
Knobbe, Martens, Olson & Bear LLP |
主权项 |
1. A sensor module comprising:
a battery housing comprising a battery cavity sized and shaped to receive a battery, the battery cavity defined at least in part by a wall configured to be disposed about at least a portion of a periphery of the battery; a package housing disposed on the wall of the battery housing, the package housing smaller than the battery housing and comprising a package cavity; an integrated device package disposed in or coupled with the package cavity, the integrated device package comprising one or more integrated device dies; an interfacing feature coupled with the battery housing and extending transverse to the wall, the interfacing feature configured to transduce a biological signature into a signal to be processed by the integrated device package; and an interconnect assembly that electrically connects the interfacing feature to the integrated device package. |
地址 |
Norwood MA US |