Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the same

摘要

The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S1: providing a first chip, wherein the first chip comprises a first substrate, an MEMS component layer formed on the first substrate and comprising a first electrical bonding point disposed on MEMS the component layer; S2: providing a second chip with an IC integrated circuit, wherein the second chip comprises a second lead layer and a second electrical bonding point; S3: bonding the first electrical bonding point and the second electrical bonding point; S4: processing a thinning operation for the bottom surface of the first substrate; and S5: forming an electrical connection layer electrically connected to an external circuit on the bottom surface of the first substrate.

主权项

1. An integrated chip with a micro-electro-mechanical system (MEMS) and an integrated circuit mounted therein, comprising:
a first chip, which comprises a first substrate defining a top-to-bottom direction, an electrical connection portion disposed in the first substrate and extending from the top face to the bottom face, an oxide layer disposed on a top face of the first substrate, an MEMS component layer disposed on the substrate and comprising a movable sensitive portion movable in a horizontal plane perpendicular to the top-to-bottom direction and a fixing portion with portions thereof penetrating the oxide layer to electrically connect with the electrical connection portion, a first lead layer formed on the oxide layer and below the movable sensitive portion with a portion thereof electrically connecting with the MEMS component layer, a first electrical bonding point disposed on the fixing portion of the MEMS component layer, an electrical connection layer disposed on an bottom face of the first substrate, wherein the first electrical bonding point and the electrical connection layer are electrically connected via the electrical connection portion and the MEMS component layer; and a second chip, which comprises a second substrate with a bottom surface toward the top face of the first substrate, the second chip being disposed on the first chip, the second chip comprising a second lead layer disposed on the bottom surface of the second substrate and a second electrical bonding point disposed on and below the bottom surface of the second substrate, the second electrical bonding point electrically connecting with the second lead layer and bonded with the first electrical bonding point, the second lead layer and the first lead layer being symmetrically disposed on two sides of the movable sensitive portion.