LOAD PORT ASSEMBLY FOR SEMICONDUCTOR PROCESS

摘要

Disclosed is a load port for a semiconductor manufacturing process. The load port receives a transported purge target container called as a front opening unified pod (FOUP) and moves a wafer stored in the FOUP between a semiconductor manufacturing apparatus and a space in the FOUP through a transport doorway formed on the front surface of the FOUP. The load port has multiple purge devices installed on the upper surface. Each of the purge devices includes: a nozzle body which enables purge gas to be injected into the FOUP or be discharged from the FOUP; a vacuum suction port which is formed to surround the nozzle body and is connected to a vacuum suction apparatus; and an adsorption pad which is installed on the upper surface while surrounding the vacuum suction port.