| 摘要 |
PROBLEM TO BE SOLVED: To provide a through electrode substrate using an insulating substrate, such as a glass substrate, having a plurality of through holes of uniform shape and size, and to provide a method of manufacturing the same, a through electrode substrate suppressing the processing amount of a glass substrate when forming a through hole, and a method of manufacturing the same.SOLUTION: A method of manufacturing a through electrode substrate includes steps for forming a hole opening to the first surface of a glass substrate having the first surface and a second surface opposing the first surface, for forming an insulating film on the inner wall including any one or both of the sidewall and bottom face of the hole, for forming a seed layer on the first surface, for thinning the second surface until the hole is exposed, for forming an electrode containing a metal material in the hole, and for removing the seed layer.SELECTED DRAWING: Figure 1 |
