| 摘要 |
PROBLEM TO BE SOLVED: To provide: a circuit board which eliminates the need for the step of removing an unwanted part in circuit pattern formation and reduces the occurrence of a trouble owing to burr of an end face of a circuit pattern and the delamination of a circuit pattern; and a method for manufacturing such a circuit board.SOLUTION: A circuit board comprises a base material 53, an adhesion layer 52 and metal electrode patterns 51a and 51b which are laminated in turn. The metal electrode patterns 51a and 51b have short-circuit prevention layers 54a and 54b made of an oxide of a metal constituting metal electrodes in their end face parts respectively. The metal electrodes are made of one of aluminum, copper, iron or an alloy thereof.SELECTED DRAWING: Figure 3 |
