发明名称 CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SOLAR BATTERY MODULE
摘要 PROBLEM TO BE SOLVED: To provide a circuit board and a solar battery module which each have a high density and which are inexpensive and highly reliable, to eliminate the need for the step of removing an unwanted part in circuit pattern formation, and to reduce the occurrence of a trouble owing to burr of an end face of a conducting circuit and the delamination of a circuit pattern.SOLUTION: A circuit board comprises a sheet material, an adhesion layer, and metal electrodes in this order. The metal electrodes are formed by cutting a piece of metal foil without removing off cut portions of the piece of metal foil. Each metal electrode has a cut end face formed by the cutting. The cut end face is inclined with respect to a perpendicular line of the sheet material. The adhesion layer is caused to protrude laterally to the cut end face to form a protruding part. A solar battery module comprises the circuit board.SELECTED DRAWING: Figure 1
申请公布号 JP2016072565(A) 申请公布日期 2016.05.09
申请号 JP20140203280 申请日期 2014.10.01
申请人 TOPPAN PRINTING CO LTD 发明人 KIKUCHI MASAHIRO
分类号 H05K1/02;H01L31/05;H05K3/04 主分类号 H05K1/02
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